Inline Ka-band transitional combline / evanescent-mode filter in conventional RF substrate using grounded vias
dc.contributor.other | IEEE Africon (2015 : Addis Ababa, Ethiopia) | |
dc.contributor.upauthor | Stander, Tinus | |
dc.date.accessioned | 2015-09-30T08:42:08Z | |
dc.date.available | 2015-09-30T08:42:08Z | |
dc.date.issued | 2015-09 | |
dc.description | Paper presented at the IEEE Africon 2015 : IEEE Africon Green Innovation for African Renaissance, 14-17 September 2015, Addis Ababa, Ethiopia. | en_ZA |
dc.description.abstract | The Ka-band is considered a viable band for future 5G backhaul links. Planar filters in this frequency range have low aspect ratios for substrates thicker than 10 mil, since the required 50 Ω line width becomes comparable to a guided wavelength. This paper proposes the use of grounded through-hole plated vias as transitional combline / evanescent-mode resonators. The principle is demonstrated with a 4th order, 27.5 – 29.5 GHz filter in a conventional 32 mil thickness RF substrate. The simulated filter features below 2 dB insertion loss across the band and occupies 3.8 x 1 mm board space. | en_ZA |
dc.description.librarian | hb2015 | en_ZA |
dc.description.sponsorship | National Research Foundation (NRF) of South Africa under Grants UID92526 and UID93921, as well as the UNESCO Participation Programme. | en_ZA |
dc.description.uri | http://africon2015.org | en_ZA |
dc.identifier.citation | Stander, T 2015, 'Inline Ka-band transitional combline / evanescent-mode filter in conventional RF substrate using grounded vias', IEEE AFRICAN 2015 conference proceedings, pp. 361-364. | en_ZA |
dc.identifier.uri | http://hdl.handle.net/2263/50111 | |
dc.language.iso | en | en_ZA |
dc.publisher | Institute of Electrical and Electronics Engineers | en_ZA |
dc.rights | © 2015 IEEE - All rights reserved. | en_ZA |
dc.subject | Microwave filters | en_ZA |
dc.subject | Microstrip filters | en_ZA |
dc.subject | Substrates | en_ZA |
dc.title | Inline Ka-band transitional combline / evanescent-mode filter in conventional RF substrate using grounded vias | en_ZA |
dc.type | Presentation | en_ZA |